Semiconductor Wafer Fabrication | Expert Silicon Wafer Services CA

Semiconductor wafer fabrication is the process of producing semiconductor devices, which include modern computer processors, memory chips, and microcontrollers. These devices are ubiquitous in electrical and electronic devices, and we use them every day. Read on for more information about the process. It also provides information about materials and equipment used in the process.

Processes

Semiconductor wafer fabrication is a complex process that involves many precision mechanical and chemical steps. Each step is designed to make the wafer’s dimensions and surface perfect, allowing it to be shaped to meet specific customer requirements. One of the most critical steps is Multi-Wiring Slicing, in which a cylinder is filled with hundreds of parallel wire segments.

The process begins by cutting a small silicon boule and grinding it to the desired diameter. The silicon boule has two orientation flats, the primary one perpendicular to the crystal axis and the secondary orientation flat, which indicates whether the silicon is p or n-type. The silicon wafers are then baked at high temperatures in order to deposit a thin film of a specific chemical on the desired zones. The final step involves implanting ions in specific patterns and depths.

Materials

The process of semiconductor wafer fabrication involves the deposition of materials on a wafer. There are various processes available for deposition, including physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE), and atomic layer deposition (ALD). Deposition is followed by removal processes, such as dry etching and reactive ion etching. After the depositing process is completed, the deposited materials are shaped and altered using patterning processes.

During the fabrication process, a mask is used to prevent unwanted materials from being removed. The masks protect the wafer from any damage during subsequent manufacturing processes.

Equipment

The process of semiconductor wafer fabrication involves various tools and machines. These tools are often used in conjunction with an automated track system, which transfers wafers from one processing station to another. Various steps of semiconductor device fabrication are required for each layer, and the tools and machines used are dependent upon the type of device that needs to be produced.

After a long decline, the semiconductor equipment industry rebounded to $39.9 billion in 2010 and $43.5 billion in 2011. The market then declined approximately 12% in 2012, to $38.2 billion. In 2013, industry analysts expect this market to shrink by 13% to $32 billion. The forecast for the industry through 2016 is generally positive.

Masks

Semiconductor wafer fabrication involves the use of masks to generate a specific pattern on the wafer. These masks are made using a photolithography process. Modern lithography systems use a complex set of lenses to accurately image the photomask onto the wafer. These systems are capable of higher resolutions than earlier systems. However, these systems have several shortcomings, including the increased complexity and physical size of the optical components.

The process of creating a mask involves a number of steps. First, the mask must be aligned with the underlying metal layers. This alignment is important because a small misalignment in the mask’s placement can cause unexpected underetching and additional step flow propagation. It can also lead to spurious morphologies and deviations in the device geometries.